DATACON 2200 EVO COMPEITORS MANUAL
DATACON 2200 EVO COMPEITORS FULL
DATACON 2200 EVO COMPEITORS PLUS

The FJ520 is designed with the flexibility for a wide range of applications and the possible requirements of future products in mind (e.g. The substantial experience of the Hesse GmbH in transducer development and ultrasonic technology, combined with the routine in building complex machines for fully automatic production has made this development possible. Unbeatable benchmark for flip chip assembly equipmentДЇLIPJET FJ520-ULTRASONIC FLIPCHIP BONDER The FlipjetВ FJ520 is the latest evolution of the Hesse GmbH flipchip bonder platform.Matching the requirements of IDMs and subcons (90% market share).Field-proven, reliable machine concept and production process.No restriction on substrate type (lead frames, strips, panels, wafers).Capability to handle any flip chip size.Operator-independent quality by fully automatic machine calibration.Exceptional accuracy of В± 10Вµm 3 Sigma at highest speed.Beside the factory-proven QUANTUM values it provides superior speed and accuracy while drastically improving your cost-of-ownership Reliable and accurate flip chip processДATACON 8800 FC QUANTUM SIGMA The Datacon 8800 FC QUANTUM sigmaВ flip chip bonder represents the next generation of the high-volume, high-accuracy 8800 platform.Operator independent results ensured by auto calibration.

DATACON 2200 EVO COMPEITORS FULL

Full recipe transfer from machine to machine.

Load recipe from host and run on any machine.

Innovative parallel activity machine design with Phi-Y movement pick-and-place.

Low vibrations вЂ“ no time wasted for motion settling.

Simultaneous movement of chip and camera вЂ“ no time wasted for image taking.

DATACON 2200 EVO COMPEITORS PLUS

Equipped with integrated dispenser, 12вЂќ wafer handling, automatic tool changer, and application specific tooling, the 2200 evo is prepared for present and future processes and products.Д®SEC 2100 FC PLUS Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders: EsecвЂ™s response to driving down the cost of flip chip technology.

Test Handlers, Test interfaces, ManipulatorsДATACON 2200 evo The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.

IC Characterization and Functional Evaluation Test System.

DC, RF, Resistivity probes and probe cards.

DATACON 2200 EVO COMPEITORS MANUAL

High speed multi Conveyor buffers вЂ“ for manual loading and unloading.? Pressure and time control (for epoxy)ДataconвЂ™s evolving 2200 apm die bonder generation outperforms the a leading manufacturer of manual and semi-automatic screen printers with nearly 1000Дў200 EVO. Manual die attach : +/- 5 degrees o Bond Line Thickness (BLT) control.

Temple, PA, USA.Дata-con 2200 APM die bonder : +/- 1 degree. Ventura, CA, USA Datacon Datacon 2200 apm plus. ? Wafer Cleaner, Semi-Auto Wafer Mounter, Manual Wafer Mounter, UV Curing System, Spindle Chiller, CO2 Injector and WaterHughes Model 2500 Hybrid Automatic Die Bonder with Manual. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.

Datacon 2200 evo compeitors